Miniaturization
USI's SiP (System-in-Package) technology can realize product features such as high efficiency, light weight, low power consumption and low latency. To help customers seize the market share of smart life, through our SiP technology, we help develop a variety of end products, from smartphones, wearable devices, self-driving V2X, health care, smart city, smart home, and smart manufacturing applications.
The benefits of SiP:
- Size (XY) reduction to have more space for battery and integrate more functions
- Reduce thickness (Z) and weight for stylish ID design
- Reduce final assembly, test & pack difficulty
- Improve signal integrity
- EMI shielding interference
- Speed up development
- Better reliability-humidity and mechanical
- Better logistics and inventory management
SiP Applications
Wireless Communication
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Cat.1/Cat.M Module
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WiFi 6E Module
