IoT Solutions
IoT Solutions
Providing modules with various networking technologies (WiFi, BT, IoT, LoRa & WWAN), USI assists customers in obtaining effective solutions for IoT-related products and provides the overall D(MS)2 (Design & Manufacturing Services plus Miniaturization & Solutions) for customer. Our comprehensive design capability and advanced packaging technology allow us to be the best partner for your next generation products. Our home grown in-house capabilities include:
- Design: Circuit Layout/Packaging Design/Electrical and Mechanical Simulation/Thermal Simulation/Debugging & Tuning/Antenna Simulation & Design
- Manufacturing Technology: High Density SMT/Molding Encapsulation/Sputtering Conformal Shielding
- Test & Qualification: Engineering Test/Qualification Test/Reliability Test/Manufacturing Test/Failure Analysis
- Regulatory & compliance test: In-House Pre-Compliance/3rd Party Lab for UL/FCC, PTCRB/Field Test and Carrier Test
- Advanced Packaging Technologies: Stacking, Double Side/Wafer Bumping/Embedded Passive/Active/Antenna Integration/Advanced Interconnection/Molding Under fill (MUF)
System On Module (SOM)
USI R&D team utilizes its leading technology in the wireless communications module market and announces its WiFi and WWAN SOM (System on Module) IoT module with NXP and Qualcomm solutions to provide customers with a variety of solutions for Internet of Things scenario.
In terms of product requirements, customers not only look for a miniaturization and robust design but also desire the development time can be shortened and more comprehensive. Our SOM IoT module adopts Qualcomm Snapdragon SDM660/SDA660 and NXP i.MX serial, by integrating a majority of the system functions and also including the application processor, memory, power processing chip, and related wireless transmission functions. The SOM IoT module can provide different choices on specific product applications, such as Rugged Handheld, Mobile POS, Rugged Tablet, Wearable Device, and Car Terminal.
In terms of product requirements, customers not only look for a miniaturization and robust design but also desire the development time can be shortened and more comprehensive. Our SOM IoT module adopts Qualcomm Snapdragon SDM660/SDA660 and NXP i.MX serial, by integrating a majority of the system functions and also including the application processor, memory, power processing chip, and related wireless transmission functions. The SOM IoT module can provide different choices on specific product applications, such as Rugged Handheld, Mobile POS, Rugged Tablet, Wearable Device, and Car Terminal.
SOM7225
Description
SOM7225 is a highly integrated System On Module (SOM) which integrates a system features with Qualcomm SM7225 processor, memory, UFS, PMIC and interface for audio codec and wireless connectivity of WiFi 802.11 a/b/g/n/ac/ax, 2x2 802.11ac MU-MIMO with BT 5.1 long range reserved. SOM7225 is a multi-band wireless WAN module with Sub-6, LTE-FDD/TDD, WCDMA, GSM, GNSS features and interface support mmWave feature reserved.
Applications
- Mobile Computer
- Rugged Tablet
- Vehicle Mount Computer
- IoT Industrial Edge Device
Features
- Qualcomm Snapdragon SM7225 Application Processor
- LPDDR4x SDRAM
- UFS 2.1 64GB Flash Memory
- 5G NR Sub-6, LTE-FDD/TDD, WCDMA, GSM, GNSS (interface for mmWave feature reserved)
- Reserve interface to support WiFi 802.11 a/b/g/n/ac/ax, 2x2 802.11ac MU-MIMO with BT 5.1 long range
- Support Android R Operating System
- One 4-lane MIPI DSI Display interface, FHD 10-bit
- Four 4-lane MIPI CSI Camera interface
- USB 3.1 Gen 1 Type C with DP1.4 and USB 2.0 for expansion
- LGA type, double side SOM
- SOM outline dimensions: 42 x 60 x 2.866 (mm)
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SOM7225
